Chemnitz Seminar - Electronic Packaging and Applications
May 06-07, 2026 • Fraunhofer ENAS, Chemnitz
Professionals and researchers will gather to discuss cutting-edge developments in electronic packaging, from advanced assembly techniques and heterogeneous integration to thermal solutions and size reduction. We look forward to presenting SweepMe! at our stand and discussing how our platform supports your measurement workflows in electronic packaging research.
